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STD Standard Shielding Adhesive Copper Foil For Phenolic Resin Board

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STD Standard Shielding Adhesive Copper Foil For Phenolic Resin Board

Brand Name : JIMA

Model Number : EDCUSTD

Certification : SGS, ISO,Reach, RoHS

Place of Origin : china

MOQ : 100kg

Price : usd 15-20 kg

Supply Ability : 1000 Ton per month

Delivery Time : 5-15 days

Packaging Details : wooden carton

Purity : 99.8%

pinholes : None

Anti oxidation : 200 degree 60 minutes, 180 days 23 degree

Thickness : 1/2 oz,3/4 oz,1 oz,2 oz,3 oz,

Color : red or gray

Elongation : ≥ 2%

tensile strength : ≥ 150 MPa

peel strength : ≥ 1 N/mm

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STD electrodeposited electrolytic ED copper foil (Standard electrodeposited electrolytic ED copper foil )

Features:

1.the treated foil in gray or red

1.High peel strength

3.Good etch ability

4.Excellent adhesion to etching resist

Application:

1. Phenolic resin board

2. Epoxy board

3. shielding

Typical properties of Standard copper foil for phenolic resin board and epoxy board.

Classification

 Unit Requirement Test Method
Foil Designation / T H M 1 2 3 IPC-4562A
Nominal thickness / 12um 1/2 OZ 3/4 OZ

1

OZ

2

OZ

3

OZ

 IPC-4562A
Area Weight g/㎡ 107±4 153±5 228±8 285±10 580±15 860±20

IPC-TM-650

2.2.12.2
Purity ％ ≥99.8

IPC-TM-650

2.3.15
Foil Profile Shiny side (Ra) սm ≤0.4 ≤0.4 ≤0.4 ≤0.4 ≤0.4 ≤0.4

IPC-TM-650

2.3.17
Matte side(Rz) um ≤6 ≤8 ≤10 ≤10 ≤15 ≤20
Tensile Strength

R.T.(23℃)

 Mpa ≥150 ≥220 ≥235 ≥280 ≥280 ≥280

IPC-TM-650

2.3.18
Elongation

R.T.(23℃)

 ％ ≥2 ≥3 ≥3 ≥4 ≥4 ≥4

IPC-TM-650

2.3.18
Subject Ω.g/㎡ ≤0.170 ≤0.166 ≤0.162 ≤0.162 ≤0.162 ≤0.162

IPC-TM-650

2.5.14
Peel Strength(FR-4) N/mm ≥1.0 ≥1.3 ≥1.6 ≥1.6 ≥2.1 ≥2.1

IPC-TM-650

2.4.8
Pinholes&porosity Number No

IPC-TM-650

2.1.2
Anti-oxidization R.T.(23℃) day 180 /
H.T.(200℃) Minutes 60 /

1. Standard Width,1295(±1)mm,May according to the customer request tailor.

2. We test the peel strength with FR-4(Tg140) prepreg ,please reconfirm with your pp.


Product Tags:

copper foil shielding

      

copper shielding tape

      
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